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SONGWON has developed a new type of laminating-free adhesive HI-THANE™ A-7363 + HI-THANE™ A-6600 for flexible packaging laminates. It is designed for printed or unprinted, metallized and laminated structures and is composed of polyethylene terephthalate (PET), biaxially oriented polypropylene (BOPP) and polyamide (PA) for printing Or barrier films, foils used for barrier films, and linear low density polyethylene (LLDPE) and cast polypropylene (CPP) films for sealing during bag manufacturing.

SONGWON stated that its new solvent-free HI-THANE™ adhesive system is easy to process and handle, and can cure quickly at 40-50°C. In addition, because the new adhesive is solvent-free and 100% reactive, it uses less energy than traditional systems during application, curing, and transportation. 

A longer curing time will have a negative impact on the delivery time and the required storage capacity, and maintaining the required temperature will result in high energy consumption. SONGWON's technology aims to solve this problem. According to the company, the new solvent-free HI-THANE™ adhesive system “creates tremendous value for film processors by increasing productivity and profitability. It gives various plastic films good wettability and excellent lamination Adhesive strength, especially PET, nylon, OPP with LLDPE and CPP. Depending on the film structure, it can be laminated at a high speed of up to 350 m/min during the lamination process. After lamination, the film can be at room temperature 1 Cut after ~3 days or 24 hours at a higher temperature (approximately 50°C).

SONGWON stated that the new solvent-free adhesive HI-THANE™ A-7363 + HI-THANE™ A-6600 is particularly heat-resistant, so it can be used in high-sealed temperature bags and boiling products under severe test conditions (100°C x 30 min) Including aluminum foil.

"We have successfully launched new solvent-free HI-THANE™ adhesive systems in some major flexible packaging manufacturers in Southeast Asia. They believe that the value proposition is different from traditional solvent-free adhesive systems," said Johnny Tay, regional sales manager. . "We are happy and proud of this new development, and believe that it will help to achieve considerable new business in the Asian region."

Victoria Hattersley spoke with Steve Sena, vice president of business development at Truvant, a packaging service provider, to find out.

Philippe Gallard, Global Innovation Director of Nestlé Water, discussed the trends and latest developments from recyclability and reusability to different packaging materials.

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